SCALE at Bonding career fair Dresden

Visit us on April 19, 2017 at the bonding career fair in Dresden!

On 19 April we will be represented with an own stand at this year's bonding carrer fair and look forward to your visit! In personal conversations, we will gladly provide information on career opportunities for, internships and final papers at SCALE.

 

As a development partner of leading automotive companies in the field of software development of complex applications for simulation data and process management, we are particularly interested in students and graduates of computer science.

 

If you are looking for challenging activities in a company with flat hierarchies and short decision paths, please visit our booth at the auditorium center of the Dresden University of Technology!

 

The Dresden bonding fair is the largest career fair organized by students in the Saxon state capital. More than 150 companies will be represented on more than 1,600 square meters. The initiative' goal is to establish contacts between students and companies.

 

Venue: Auditorium Center TU Dresden | Date: 19/04/2017 | Time: 9 am - 5 pm | Further information

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contact Heiner Müllerschön
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